Agile Software Corporation, provider of product Lifecycle management (PLM) solutions, announced last week that Spansion will deploy Agile PLM across its entire enterprise to improve enterprise security, and enhance visibility, management and collaboration of new and changing product record information across the extended supply chain. Spansion chose Agile based on the company's unrivaled semiconductor industry domain expertise, fastest time to value and lowest total cost of ownership.

"With such a large installed base and numerous partners across our global supply chain, we required a secure, collaborative PLM solution," says Michael Lipsey, vice president of Business Process Integration, Spansion. "Agile's intuitive interface requires low maintenance and a simple integration scheme using one central depository."

In addition to being deployed in several Spansion business units, Agile Product Collaboration will be deployed globally in Spansion's worldwide offices and manufacturing facilities. Agile Product Collaboration provides Spansion with a secure environment to manage and control manufacturers and their product content, in addition to synchronization of manufacturing systems with the current product record. With enhanced visibility and management of site-specific product information across global operations and the extended supply network, Spansion now has access to critical product data, allowing the company to rapidly introduce the highest quality products to market, increase product profitability, reduce costs, and improve the quality of its products and services worldwide.

"In the ultra-competitive semiconductor industry, the ability to quickly develop high quality products that meet market demand is an imperative for survival," said Jay Fulcher, Agile president and CEO. "Agile remains committed to the success of our global semiconductor customers. With our broad suite of best in class PLM solutions, market leaders like Spansion are able to drive innovation, optimize performance, and improve cost efficiencies throughout the product lifecycle."